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IntraCu ® is a series of patented electrodepositing additives for wafer level packaging applications.  They are used for semiconductor electrodepositing copper pillar, redistribution layer (RDL), and under bump metallization. 
In addition to yielding excellent within die uniformity, our additives offers unmatched ability to modulate bump shape (flat or slightly dish) and also exhibit excellent product/process stability, and wide process window.
Shinhao Materials offers complementary bath analyses during customer trial period, as well as other services that customers may desire.





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